High density interconnect manufacturing and fabrication.
In today's competitive global printed circuit board marketplace, our customers require us to
exceed the capabilities and technologies of other HDI PCB manufacturers. Flex PCB is an industry
of providing High Density Interconnects (HDI PCBs) for a wide range of different types of
few of those infdustries include: military, aerospace, supercomputing, medical devices,
silicon testing, and chip packaging.
With Flex PCB's high density interconnection capabilities include state-of-the-art UV Yag and CO2
drilled 50 micron microvias, blind and buried vias, 19 micron line and space widths, solid
via-in-pad technology metal core, plated edge holes, thin builed-up materials, fine pitches, and
When you utilize our HDI circuit manufacturing services over traditional PCB
fabrication, you can
significantly increase your ROI by saving space and weight.
Microvias pad size to a via diameter of +150 microns
Blind microvia plating aspect ratio (depth to diameter): 1.2:1
Core dielectric thickness down to 12 microns
Blind and buried via construction with sequential build technology
Copper via fill available
Contact us today at 888-397-9545 or email@example.com to learn more about Flex
PCB and how we can provide your company with the most highly complex HDI printed
circuit boards manufacturered in the market today.