Capabilities.

Flex, rigid-flex, and HDI substrates for all applications and markets.

Product Standard Flex Circuits Standard Rigid-flex Circuits High Density Interconnect (HDI) Flex Circuits
Standard Panel Size 250mm x 400 mm 100mm x 100mm 250mm x 400mm
Line Width and Spacing .003" (0.07mm) .003" (0.07mm) .003" (0.07mm)
Copper Thickness 1/2 oz. and higher 1/4 to 1/2 oz. 1/2 oz. and higher
Layer Count 10 Up to 4 Up to 18
Via/ Drill Size
Minimum Drill (Mechanical) Hole Diameter .008" (0.2 mm) .006" (0.15 mm) .008" (0.2 mm)
Minimum Via (Laser) Size 5 mil (0.15 mm) 1 mil (0.025 mm) 6 mil (0.15 mm)
Minimum Micro Via (Laser) Size 3 mil (0.07 mm) 1 mil (0.025 mm) 3 mil (0.07 mm)
Stiffener Material Polyimide / FR4 / Metal Polyimide / FR4 / Metal Polyimide / FR4
Shielding Material Copper / Silver Ink / Tatsuta / Carbon Copper / Silver Ink / Tatsuta / Carbon Copper / Silver Ink / Tatsuta / Carbon
Tooling Tolerance 2 mil (0.05 mm) 1 mil (0.025 mm) 2 mil (0.05 mm)
Zif Tolerance 2 mil (0.05 mm) 1 mil (0.025 mm) 2 mil (0.05 mm)
Solder Mask
Solder Mask Bridge Between Dam 5 mil (0.13 mm) 4 mil (0.11 mm) 5 mil (0.13 mm)
Solder Mask Registration Tolerance 4 mil (0.11 mm) 4 mil (0.11 mm) 5 mil (0.13 mm)
Coverlay
Coverlay Registration 8 mil (0.20 mm) 5 mil (0.13 mm) 8 mil (0.20 mm)
PIC Registration 7 mil (0.18 mm) 4 mil (0.11 mm) 7 mil (0.18 mm)
Solder Mask Registration 5 mil (0.13 mm) 4 mil (0.11 mm) 5 mil (0.13 mm)
Stiffener
PI Stiffener      
Stiffener Registration 10 mil (0.25 mm) 10 mil (0.25 mm) 10 mil (0.25 mm)
Thickness Tolerance 10% 10% 10%
FR4 Stiffener      
Stiffener Registration 10 mil (0.25 mm) 10 mil (0.25 mm) Layer to Layer
Thickness Registration 10% 10% 5 mil (0.13 mm)
Legend
Minimum Height 35 mil (0.89 mm) 25 mil (0.64 mm) 35 mil (0.89 mm)
Minimum Width 8 mil (0.20 mm) 6 mil (0.15 mm) 8 mil (0.20 mm)
Minimum Space 8 mil (0.20 mm) 6 mil (0.15 mm) 8 mil (0.20 mm)
Registration +/- 5 mil (0.13 mm) +/- 5 mil (0.13 mm) +/- 5 mil (0.13 mm)
Impedance +/- 10% +/- 10% +/- 10%
SRD (Steel Rule Die)
Outline Tolerance 5 mil (0.13 mm) 2 mil (0.051 mm) 5 mil (0.13 mm)
Minimum Radius 5 mil (0.13 mm) 4 mil (0.11 mm) 5 mil (0.13 mm)
Inside Radius 20 mil (0.51 mm) 10 mil (0.25 mm) 31 mil (0.79 mm)
Punch Minimum Hole Size 40 mil (1.02 mm) 31.5 mil (0.80 mm) N/A
Tolerance of Punch Hole Size +/- 2 mil (0.051 mm) +/- 1 mil (0.025 mm) N/A
Slot Width 20 mil (0.51 mm) 15 mil (0.38 mm) 31 mil (0.79 mm)
Tolerance of Hole to Outline +/- 3 mil (0.07 mm) +/- 2 mil (0.051 mm) +/- 4 mil (0.11 mm)
Tolerance of Hole Edge to Outline +/- 4 mil (0.11 mm) +/- 3 mil (0.07 mm) +/- 5 mil (0.13 mm)
Minimum of Trace to Outline 8 mil (0.20 mm) 5 mil (0.13 mm) 10 mil (0.25 mm)

Please contact us directly if you have any questions after you have reviewed our Flex, Rigid-flex, and HDI PCB fabrication capabilities above. We can help you with any Flex PCB assembly, engineering, design, and manufacturing questions. We look forward to becoming your one-stop PCB supplier.

Our HDI flex and rigid-flex PCB manufacturing facilities are located in the USA and China.